是否无铅 |
不含铅 不含铅 |
|
|
|
|
|
生命周期 |
Active |
|
|
|
|
|
Objectid |
1657384807 |
|
|
|
|
|
零件包装代码 |
BGA |
|
|
|
|
|
包装说明 |
FTBGA-256 |
|
|
|
|
|
针数 |
256 |
|
|
|
|
|
Reach Compliance Code |
compliant |
|
|
|
|
|
Country Of Origin |
Taiwan |
|
|
|
|
|
ECCN代码 |
EAR99 |
|
|
|
|
|
HTS代码 |
8542.39.00.01 |
|
|
|
|
|
Factory Lead Time |
52 weeks |
|
|
|
|
|
风险等级 |
0.75 |
|
|
|
|
|
Samacsys Description |
FPGA - Field Programmable Gate Array XC3S200A-4FTG256I CONNECTING EBOM TO MARKETING PART |
|
|
|
|
|
Samacsys Manufacturer |
XILINX |
|
|
|
|
|
Samacsys Modified On |
2021/8/26 6:25 |
|
|
|
|
|
YTEOL |
5.2 |
|
|
|
|
|
CLB-Max的组合延迟 |
0.71 ns |
|
|
|
|
|
JESD-30 代码 |
S-PBGA-B256 |
|
|
|
|
|
JESD-609代码 |
e1 |
|
|
|
|
|
长度 |
17 mm |
|
|
|
|
|
湿度敏感等级 |
3 |
|
|
|
|
|
可配置逻辑块数量 |
448 |
|
|
|
|
|
等效关口数量 |
200000 |
|
|
|
|
|
输入次数 |
195 |
|
|
|
|
|
逻辑单元数量 |
4032 |
|
|
|
|
|
输出次数 |
160 |
|
|
|
|
|
端子数量 |
256 |
|
|
|
|
|
组织 |
448 CLBS, 200000 GATES |
|
|
|
|
|
封装主体材料 |
PLASTIC/EPOXY |
|
|
|
|
|
封装代码 |
LBGA |
|
|
|
|
|
封装等效代码 |
BGA256,16X16,40 |
|
|
|
|
|
封装形状 |
SQUARE |
|
|
|
|
|
封装形式 |
GRID ARRAY, LOW PROFILE |
|
|
|
|
|
峰值回流温度(摄氏度) |
260 |
|
|
|
|
|
电源 |
1.2,2.5/3.3 V |
|
|
|
|
|
可编程逻辑类型 |
FIELD PROGRAMMABLE GATE ARRAY |
|
|
|
|
|
子类别 |
Field Programmable Gate Arrays |
|
|
|
|
|
标称供电电压 |
1.2 V |
|
|
|
|
|
表面贴装 |
YES |
|
|
|
|
|
技术 |
CMOS |
|
|
|
|
|
温度等级 |
INDUSTRIAL |
|
|
|
|
|
端子面层 |
TIN SILVER COPPER |
|
|
|
|
|
端子形式 |
BALL |
|
|
|
|
|
端子节距 |
1 mm |
|
|
|
|
|
端子位置 |
BOTTOM |
|
|
|
|
|
宽度 |
17 mm |
|
|
|
|
|